


Let's start engineering impact together
GlobalLogic provides unique experience and expertise at the intersection of data, design, and engineering.
Get in touch
The next billion AI decisions won’t happen in the cloud- they will happen at the edge, and the enterprise question of 2026 is no longer whether to deploy AI at the edge. It’s whether the edge AI you’ve deployed can be trusted to act intelligently, instantly, and securely.
Across autonomous robots, medical devices, industrial control systems, and connected vehicles, the same loop is taking shape: sense, decide, act, learn — happening on-device, in milliseconds, without a cloud round-trip. That loop is what makes Physical AI different from cloud AI with a sensor attached. It is also what makes Physical AI genuinely hard to build.
Reliable on-device intelligence demands decisive, real-time control in environments where safety, uptime, and performance are non-negotiable. Most enterprises are discovering that the constraint isn’t the AI model. It isn’t even the compute. It’s the memory architecture underneath both.
The Edge AI Bottleneck: Latency, Power, and Reliability
In the cloud, latency is measured in tens to hundreds of milliseconds. At the extreme edge, safety and vision tasks demand sub-millisecond to single-digit millisecond responses. Beyond speed, Edge AI is governed by what we call the Trinity of Constraints:
- Latency: Real-time tasks such as autonomous navigation, robotic arms, industrial control systems, and medical devices cannot wait for cloud round-trips.
- Thermal & Power: Battery-powered Edge AI or IoT devices hold standby power is indeed in the microwatt range, but, active power during inference is far higher.
- Reliability: Constant uptime is required without dependence on the cloud.
Compute has become relatively cheap. Moving data has not. For neural network inference to work efficiently — and for the sense-decide-act loop to close fast enough to be safe — data must stay as close to the logic core as physically possible. That is a memory latency problem before it is anything else.

The Memory Gap and ApSRAM as the Emerging Solution
Developers have traditionally had two choices, both of which struggle with modern Edge AI demands.
SRAM (The Area Limit) is extremely fast, but traditional 6T SRAM consumes significant die area. As process nodes move below 5nm, large on-die SRAM becomes increasingly expensive and impractical for mass-market Edge AI devices.
DRAM (The Power Limit) delivers high density but requires continuous refresh, external interfaces, and controller overhead – driving up power consumption, PCB complexity, and overall BOM cost.
This is the Gap: Edge AI applications need high density, low power, compact form factors, and low pin count, simultaneously. Neither traditional options delivers all four.
Attached Pseudo-SRAM (PSRAM) has emerged as the ideal middle ground. It offers a simple, easy-to-use SRAM interface with much higher density and lower cost-per-bit. Self-refresh and partial-array refresh provide an optimized standby mode for battery-operated devices, and instant-on functionality skips the lengthy initialization required by traditional DRAM. PSRAM closes the Gap — but only if the controller layer is built to exploit it.
The Silicon Foundation of Physical AI at GlobalLogic
This is where GlobalLogic’s silicon and embedded engineering practice creates real differentiation. The on-device intelligence story doesn’t end with a model and a chip; it depends on the system architectural layer that determines whether intelligence at the edge remains a promising concept or becomes truly deployable at scale.
Mobiveil, a GlobalLogic company, has spent over a decade engineering that layer. Our PSRAM, ApSRAM and VHM controllers deliver the architectural advantage Edge AI requires: die-to-die connectivity that reduces dependence on complex PHY implementations, lower latency, reduced power consumption, and simplified system integration. Tightly coupled architectures optimize board space and package footprint — making them well-suited to Edge AI devices, automotive electronics, and next-generation intelligent endpoints.
The engineering payoff shows up in three places.
- Reduced firmware overhead. Specialized controllers for JEDEC xSPI, UHS PSRAM, HyperRAM, and PSRAM feature auto-initiation, automatic page boundary, and automatic die crossing — moving complexity out of firmware and into silicon.
- Configurability without redesign. A single family of silicon-proven controllers, configurable to specific customer requirements rather than requiring custom IP for each device class.
- Production heritage. Our Universal Multiport Memory Controller, originally deployed in millions of products as a trusted DDR controller, has been repurposed for the high-throughput, low-power demands of edge applications.
Together, these capabilities give the sense-decide-act loop the substrate it needs to run reliably, on-device, at scale.
What This Makes Possible
Our work across a range of edge and wearable AI platforms, including smart glasses. AR/VR systems and intelligent displays – highlights the growing importance of memory efficiency at the edge. Realtime AI inference, Sensor fusion, person detection, and low latency decision making are all ultimately constrained by how efficiently memory moves data to the compute and inference engines.
That is the difference between an Edge AI roadmap that demos and one that deploys.
The Engineering That Makes On-Device Intelligence Real
Physical AI is not a product category. It is a discipline; the engineering of systems that sense, reason, and act reliably in environments where the cost of latency or failure is measured in safety, not user experience. The memory controller is one of the layers where that discipline is decided.
Whether the application is a high-end smartphone digital cockpit, an industrial portable instrument, or a smart wearable, the goal remains the same: providing the most intelligent experience with the least power, the most predictable response, and the fewest assumptions about what the network will do.
GlobalLogic builds that layer.
Exploring memory architecture for an Edge AI program? Let’s talk.
You might also like:




